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SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
Parameters such as edge length and diagonal of a wafer appear to be obvious
As a result
SEMI M8-1296 (technical revision)
M07700 - SEMI M77 - Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA Revision:SEMI M77-1015 (Reapproved 0421) - Current SEMI G18 — Specification forWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The roll off amount (ROA) metric is suitable for quantifying near edge geometry of wafers used in semiconductor device processing. Consideration should be given to the use