Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 not for material removal

not for material removal

This method is also applicable to stress-rupture evaluations of pipes which are difficult to test

you can standardize the operating conditions of mechanical influences to land-based and off-shore

and requirements for typical equipment used for visual testing

Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 not for material removal1 Scope This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine pitch Ball Grid Array (FBGA), and Fine pitch Land Grid Array (FLGA).